Papa Kaapuni PCB paakiki
| Kauoha Qty. | Nuipa? iecaianoaaiiuo | Hana laʻana | |
| Helu papa | 2~ 32L | 48L | |
| Max.Mānoanoa PCB | 12mm (472mil) | 12mm (472mil) | |
| Min.Laulā/Lua | Papa loko | 2.5mil/ 2.5mil | 2.2mil/ 2.2mil |
| Papa waho | 3mil/3mil | 2.8mil/ 2.8mil | |
| Max.Mānoanoa keleawe | 6Oz | 30Oz | |
| Min.Anawaena wili lua | Puka mīkini | 0.15mm (6mil) | 0.1mm (4mil) |
| Puka laser | 0.1mm (4mil) | 0.075mm (3mil) | |
| Max.Nui (Luna Hoʻopau) | Nā papa ʻaoʻao hoʻokahi a ʻelua ʻaoʻao | 1150mmX500mm | 1250mmX550mm |
| ʻAhaʻi nui | / | 1250mmX570mm | |
| Laki hiʻohiʻona (Hole Hoʻopau) | 10:01:00 | 16:01:00 | |
| Mea waiwai | FR4 | S1000-2, IT180A, IT158, S1000 / S1155, KB6167 | |
| ʻO ke alapine kiʻekiʻe | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, Ro5880 | ||
| ʻO nā mea ʻē aʻe | Alu.-based, Cu-based etc. | ||
| Hoʻopau ʻili | HASL, ENIG, Immersion Tin, OSP, Immersion Silver,Electroplating Gula Paʻa/Kula Māmā, Manalima Gula, OSP koho, ENEPIG. | ||
| KaumahaPCB | Max.Mānoanoa keleawe | 6Oz | 30Oz |
| HDI PCB | Hoʻolālā | Kekahi Layer (10L) | Kekahi Layer (10L) |
| Laulā/Lua (Layer waho) | 2.5mil/2.5mil | 2mil/2mil | |
| ʻAspect Ratio(Blind Hole) | 1:01:00AM | 1:01:00 | |